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Posted Apr 8, 2008 08:50 by Abraham A. Listed in: Rumors, iPhone, iPhone Tags: 3G, HSDPA, Wall Street Journal, iPhone
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SGold3 embedded in Apple iPhone firmware 2.0 - Image 1  


The 3G iPhone rumor is really gaining some steam. After Wall Street Journal's Walt Mossberg claimed that the 3G iPhone will be out in sixty days, more evidence has emerged in the form of a string of characters found in the latest Apple iPhone beta firmware 2.0.

The word "SGOLD3" can be found embedded in the source code of the latest beta firmware. Click the image above for a higher resolution. Current iPhones are powered by Infineon's S-GOLD2 chips so SGOLD3 may refer to the follow-up chip from Infineon.

Infineon has a 7.2 Mbps HSDPA chip called PMB8878. This chip is also known as S-GOLD3H. Its capabilities are naturally far more superior with a 5-megapixel camera, 2x speed MMC/SD interface and DVB-H support.

Now, that begs the question: is it possible that this will be the baseband for the 3G iPhone. Stay tuned here at QJ.NET for more updates

Image courtesy of ZiPhone.

[Via ZiPhone] Permalink  |   Email this  |   Linking Blogs   |   Digg It!

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